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Solution

Solution

Solution

Cleaning

Damage Free

Offering

  • Minimum grinding and non-physical cleaning
  • Chamber process by-product selective Special cleaning technology
  • Minimizes the damages on substrates in the coating stripping process
  • Dry cleaning technology using ultra fine grains
  • Verifies condition of substrate through optical and laser microscope

Benefit

  • Parts life span extension
  • Particles decrease in chamber process
  • Minimizes the variables of the process by yttria coating surface roughness recovery technology
  • Minimized the damages in anodizing, substrate, and coating with yttria coating chemical cleaning

Application

  • LAM, TEL, AMAT, ULVAC, SEMES etc.

Applicable Technology

Technology Name Technology Full Name Technology Detail Brochure
No-Dam.™ No-Dam.™ Coating stripping technology using the water jet technology
MPS™ Micro Powder Spray Pellet Size CO2 cleaning technology
PSC™ Pure Surface Clean Snow Size CO2 cleaning technology
PBC™ Pulse Beam Clean Deposition removal technology using pulse beam
PRC™ Physical Ra Control Physical method application
Coating Decap.™ Coating Decapsulation Coating strip technology using chemical compounds.